{"product_id":"sc-10c-full-automatic-silicon-wafer-laser-cutting-machine","title":"SC-10C Full Automatic Silicon Wafer Laser Cutting Machine","description":"\u003cblockquote\u003e\n\u003cp\u003eSC-10C Full Automatic Silicon Wafer Laser Cutting Machine by Ooitech - High-speed precision cutting equipment for solar cell production with 860PCS\/H capacity, ±0.15mm accuracy, dual loading system, and 300W fiber laser for M6\/M10\/M12 wafer processing\u003c\/p\u003e\n\u003c\/blockquote\u003e\n\u003ch4\u003eSC-10C Full Automatic Silicon Wafer Laser Cutting Machine - High Precision Solar Cell Production Equipment\u003c\/h4\u003e\n\u003cp\u003eSC-10C Full Automatic Silicon Wafer Laser Cutting Machine by Ooitech - High-speed precision cutting equipment for solar cell production with 860PCS\/H capacity, ±0.15mm accuracy, dual loading system, and 300W fiber laser for M6\/M10\/M12 wafer processing\u003c\/p\u003e\n\u003chr\u003e\n\u003chr\u003e\n\u003ch5\u003eProduct Introduction\u003c\/h5\u003e\n\u003cp\u003eThe \u003cstrong\u003eSC-10C Full Automatic Silicon Wafer Laser Cutting Machine\u003c\/strong\u003e represents cutting-edge technology in solar cell manufacturing, specifically designed for high-precision cutting of silicon wafer edges and rounded corners. This advanced equipment from \u003cstrong\u003eOoitech\u003c\/strong\u003e (\u003ca href=\"http:\/\/www.ooitech.com\"\u003ewww.ooitech.com\u003c\/a\u003e) integrates seamlessly into modern solar panel production lines, supporting the industry's transition to higher efficiency cell formats including PERC, TOPCon, IBC, ABC, and HPBC technologies.\u003c\/p\u003e\n\u003cp\u003eThe system features a comprehensive modular design including \u003cstrong\u003edual A\/B loading boxes\u003c\/strong\u003e, automatic loading modules, precision positioning mechanisms, cutting worktable with high-vacuum absorption, X\/Y cutting modules with servo motor drives, professional fiber laser optical system, automatic unloading modules, and dual finished product collection boxes. The equipment operates on a fully automated principle where silicon wafers are transferred from loading boxes to the cutting worktable, precisely positioned, cut with exceptional accuracy, and then automatically transferred to finished product boxes.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eKey Application\u003c\/strong\u003e: Suitable for processing wafer sizes from 210×210mm down to 158.75×158.75mm, accommodating all mainstream formats including M6, M10, and M12 specifications with thickness ranges from 120-220μm.\u003c\/p\u003e\n\u003ch5\u003eTechnical Specifications\u003c\/h5\u003e\n\u003ch6\u003ePerformance Parameters\u003c\/h6\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel Number\u003c\/td\u003e\n\u003ctd\u003eSC-10C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduction Capacity\u003c\/td\u003e\n\u003ctd\u003e≥860 PCS\/H (156×156mm, 4 cuts)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCutting Accuracy\u003c\/td\u003e\n\u003ctd\u003e±0.15mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaximum Operating Speed\u003c\/td\u003e\n\u003ctd\u003e1000mm\/s (adjustable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWafer Size Range\u003c\/td\u003e\n\u003ctd\u003e210×210mm - 158.75×158.75mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWafer Thickness Range\u003c\/td\u003e\n\u003ctd\u003e120-220μm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorktable Size\u003c\/td\u003e\n\u003ctd\u003e140×140mm (optional 170×170mm)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eX\/Y Travel Range\u003c\/td\u003e\n\u003ctd\u003e650×650mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEdge Drop Size\u003c\/td\u003e\n\u003ctd\u003e≤0.15mm\/edge\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLoading Box Capacity\u003c\/td\u003e\n\u003ctd\u003e2 boxes, 250 pieces\/box\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBreakage Rate\u003c\/td\u003e\n\u003ctd\u003e≤3% (≤1.5% for Grade A wafers)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEquipment Failure Rate\u003c\/td\u003e\n\u003ctd\u003e≤3%\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch6\u003eLaser System Specifications\u003c\/h6\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eLaser Type\u003c\/td\u003e\n\u003ctd\u003eFiber Laser\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLaser Wavelength\u003c\/td\u003e\n\u003ctd\u003e1064nm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLaser Power\u003c\/td\u003e\n\u003ctd\u003e300W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling Method\u003c\/td\u003e\n\u003ctd\u003eAir Cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFocusing System\u003c\/td\u003e\n\u003ctd\u003eShort Focal Length\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCutting Head\u003c\/td\u003e\n\u003ctd\u003eCustomized Professional\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch6\u003ePhysical \u0026amp; Utility Requirements\u003c\/h6\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eEquipment Dimensions\u003c\/td\u003e\n\u003ctd\u003e1900×1250×1850mm (L×W×H)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEquipment Weight\u003c\/td\u003e\n\u003ctd\u003e930kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Supply\u003c\/td\u003e\n\u003ctd\u003e380V\/50Hz, 3-phase 5-wire\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e3.5kW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompressed Air Pressure\u003c\/td\u003e\n\u003ctd\u003e6-8 Bar\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAir Flow Rate\u003c\/td\u003e\n\u003ctd\u003e≥400L\/min\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAuxiliary Gas Pressure\u003c\/td\u003e\n\u003ctd\u003e0.5-1.0 MPa\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDust Collection Interface\u003c\/td\u003e\n\u003ctd\u003eΦ200mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRequired Airflow\u003c\/td\u003e\n\u003ctd\u003e≥1800m³\/hour\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch5\u003eTechnical Advantages\u003c\/h5\u003e\n\u003ch6\u003ePrecision Engineering Excellence\u003c\/h6\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eUltra-High Precision\u003c\/strong\u003e: Advanced servo motor control system with linear guide rails and ball screw modules ensures cutting accuracy of ±0.15mm\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eNon-Stop Operation\u003c\/strong\u003e: Dual loading\/unloading boxes enable continuous production without interruption during material changeover\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIntelligent Detection Systems\u003c\/strong\u003e: Integrated wafer presence detection, thickness measurement, and successful pickup verification sensors\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBernoulli Non-Contact Technology\u003c\/strong\u003e: Special vacuum suction cups prevent wafer surface damage during handling\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch6\u003eAdvanced Control \u0026amp; Software\u003c\/h6\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eUser-Friendly Interface\u003c\/strong\u003e: 10-inch touchscreen with intuitive operation and multi-level password protection\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCAD\/DXF Import Support\u003c\/strong\u003e: Direct import of cutting patterns from design software\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eReal-Time Monitoring\u003c\/strong\u003e: Comprehensive fault alarm system with diagnostic capabilities\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePLC Control System\u003c\/strong\u003e:\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Ooitech","offers":[{"title":"Default Title","offer_id":44198345736291,"sku":null,"price":42000.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0560\/1427\/4659\/files\/w800_h600_fitblur_v2_1774340166130021.webp?v=1779418932","url":"https:\/\/ooitechchina.myshopify.com\/en-global\/products\/sc-10c-full-automatic-silicon-wafer-laser-cutting-machine","provider":"Solar Panel Making Machine","version":"1.0","type":"link"}