SC-10C Full Automatic Silicon Wafer Laser Cutting Machine by Ooitech - High-speed precision cutting equipment for solar cell production with 860PCS/H capacity, ±0.15mm accuracy, dual loading system, and 300W fiber laser for M6/M10/M12 wafer processing
SC-10C Full Automatic Silicon Wafer Laser Cutting Machine - High Precision Solar Cell Production Equipment
SC-10C Full Automatic Silicon Wafer Laser Cutting Machine by Ooitech - High-speed precision cutting equipment for solar cell production with 860PCS/H capacity, ±0.15mm accuracy, dual loading system, and 300W fiber laser for M6/M10/M12 wafer processing
Product Introduction
The SC-10C Full Automatic Silicon Wafer Laser Cutting Machine represents cutting-edge technology in solar cell manufacturing, specifically designed for high-precision cutting of silicon wafer edges and rounded corners. This advanced equipment from Ooitech (www.ooitech.com) integrates seamlessly into modern solar panel production lines, supporting the industry's transition to higher efficiency cell formats including PERC, TOPCon, IBC, ABC, and HPBC technologies.
The system features a comprehensive modular design including dual A/B loading boxes, automatic loading modules, precision positioning mechanisms, cutting worktable with high-vacuum absorption, X/Y cutting modules with servo motor drives, professional fiber laser optical system, automatic unloading modules, and dual finished product collection boxes. The equipment operates on a fully automated principle where silicon wafers are transferred from loading boxes to the cutting worktable, precisely positioned, cut with exceptional accuracy, and then automatically transferred to finished product boxes.
Key Application: Suitable for processing wafer sizes from 210×210mm down to 158.75×158.75mm, accommodating all mainstream formats including M6, M10, and M12 specifications with thickness ranges from 120-220μm.
Technical Specifications
Performance Parameters
| Parameter | Specification |
|---|---|
| Model Number | SC-10C |
| Production Capacity | ≥860 PCS/H (156×156mm, 4 cuts) |
| Cutting Accuracy | ±0.15mm |
| Maximum Operating Speed | 1000mm/s (adjustable) |
| Wafer Size Range | 210×210mm - 158.75×158.75mm |
| Wafer Thickness Range | 120-220μm |
| Worktable Size | 140×140mm (optional 170×170mm) |
| X/Y Travel Range | 650×650mm |
| Edge Drop Size | ≤0.15mm/edge |
| Loading Box Capacity | 2 boxes, 250 pieces/box |
| Breakage Rate | ≤3% (≤1.5% for Grade A wafers) |
| Equipment Failure Rate | ≤3% |
Laser System Specifications
| Parameter | Specification |
|---|---|
| Laser Type | Fiber Laser |
| Laser Wavelength | 1064nm |
| Laser Power | 300W |
| Cooling Method | Air Cooling |
| Focusing System | Short Focal Length |
| Cutting Head | Customized Professional |
Physical & Utility Requirements
| Parameter | Specification |
|---|---|
| Equipment Dimensions | 1900×1250×1850mm (L×W×H) |
| Equipment Weight | 930kg |
| Power Supply | 380V/50Hz, 3-phase 5-wire |
| Power Consumption | 3.5kW |
| Compressed Air Pressure | 6-8 Bar |
| Air Flow Rate | ≥400L/min |
| Auxiliary Gas Pressure | 0.5-1.0 MPa |
| Dust Collection Interface | Φ200mm |
| Required Airflow | ≥1800m³/hour |
Technical Advantages
Precision Engineering Excellence
- Ultra-High Precision: Advanced servo motor control system with linear guide rails and ball screw modules ensures cutting accuracy of ±0.15mm
- Non-Stop Operation: Dual loading/unloading boxes enable continuous production without interruption during material changeover
- Intelligent Detection Systems: Integrated wafer presence detection, thickness measurement, and successful pickup verification sensors
- Bernoulli Non-Contact Technology: Special vacuum suction cups prevent wafer surface damage during handling
Advanced Control & Software
- User-Friendly Interface: 10-inch touchscreen with intuitive operation and multi-level password protection
- CAD/DXF Import Support: Direct import of cutting patterns from design software
- Real-Time Monitoring: Comprehensive fault alarm system with diagnostic capabilities
- PLC Control System:
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